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* Published Japanese patents only


Hits 23 results

No. Application number
Gazette No
Title
Release Date
Update Date
Information Provider
1 P2016-018817 P2017-139314A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE Feb 22, 2019 Feb 22, 2019 Keio University
2 P2016-086074 P2017-193770A Ru DEPOSITION METHOD, Ru DEPOSITION APPARATUS, METAL DEPOSITION APPARATUS, Ru BARRIER METAL LAYER, AND WIRING STRUCTURE meetings Nov 21, 2017 Jan 24, 2018 Ibaraki University
3 P2016-035760 P2017-152628A DEPOSITION APPARATUS OF COPPER, DEPOSITION METHOD OF COPPER, COPPER WIRING FORMATION METHOD, COPPER WIRING meetings Sep 26, 2017 Nov 21, 2017 Ibaraki University
4 P2015-183828 P2016-164965A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH ULTRA-LOW RESISTIVITY COPPER WIRING meetings Oct 5, 2016 Jan 10, 2017 Ibaraki University
5 P2010-525664 P5575648 (In Japanese) クラスタ噴射式加工方法 foreign Feb 24, 2014 Jan 18, 2018 Kyoto University
6 P2012-124608 P5963191 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME Dec 20, 2013 Dec 26, 2017 Ibaraki University
7 P2011-197115 P5773491 COBALT THIN FILM AND FORMATION METHOD THEREOF AND NANO-JUNCTION ELEMENT AND MANUFACTURING METHOD THEREFOR AND WIRING AND FORMATION METHOD THEREOF Apr 4, 2013 Jan 17, 2018 Hokkaido University
8 P2008-205198 P5187689 NANOWIRE STRUCTURE, NANOWIRE AGGREGATE, AND MANUFACTURING METHOD THEREFOR commons Mar 27, 2013 Feb 2, 2018 Kansai University
9 P2009-030440 P5486821 ELECTROLESS COPPER-PLATING SOLUTION, ELECTROLESS COPPER-PLATING METHOD AND METHOD FOR FORMING EMBEDDED WIRING commons meetings Mar 27, 2013 Jan 23, 2018 Kansai University
10 P2009-220867 P5377195 ELECTROLESS COPPER-PLATING SOLUTION, ELECTROLESS COPPER-PLATING METHOD, AND METHOD FOR FORMING OF EMBEDDED WIRING commons Mar 27, 2013 Jan 23, 2018 Kansai University
11 P2011-030514 P5754702 SEARCH METHOD OF BARRIER MATERIAL FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND BARRIER MATERIAL FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SEARCHED BY THE SEARCH METHOD meetings Mar 11, 2013 Jan 10, 2018 Ibaraki University
12 P2010-541378 P5366270 (In Japanese) 半導体集積回路装置及びその製造方法 meetings May 21, 2012 Jan 18, 2018 Ibaraki University
13 P2010-107764 P5198506 METHOD OF MANUFACTURING FUNCTIONAL DEVICE, THIN-FILM TRANSISTOR, AND PIEZOELECTRIC INKJET HEAD Nov 28, 2011 Jan 15, 2018 Japan Science and Technology Agency
14 P2010-090578 P5618599 PATTERN FORMATION METHOD Jul 14, 2011 Jan 15, 2018 Japan Science and Technology Agency
15 P2011-022414 P5747406 METHOD OF EVALUATING CRYSTAL PARTICLE SIZE AND PARTICLE SIZE DISTRIBUTION IN METAL LAYER AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME meetings May 9, 2011 Jan 10, 2018 Ibaraki University
16 P2006-514112 P4815603 (In Japanese) 超臨界流体又は亜臨界流体を用いた酸化物薄膜、又は金属積層薄膜の成膜方法、及び成膜装置 meetings foreign Dec 25, 2009 Feb 21, 2018 University of Yamanashi
17 P2009-077629 P5057176 PATTERN FOR EVALUATING METAL WIRING, SEMICONDUCTOR DEVICE AND EVALUATION METHOD commons Apr 17, 2009 Jan 24, 2018 Japan Science and Technology Agency
18 P2007-106945 P5370979 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF meetings Nov 7, 2008 Feb 16, 2018 Ibaraki University
19 P2005-072030 P4710002 METHOD FOR MANUFACTURING FILM Aug 31, 2007 Feb 27, 2018 Tokyo University of Agriculture and Technology
20 P2003-403597 P4288347 MICRO NANO PATTERN STRUCTURE AND ITS MANUFACTURING METHOD Jul 27, 2007 Mar 7, 2018 Nagoya Institute of Technology
21 P2005-124734 P4608613 LASER IRRADIATION MICROWORKING METHOD AND SEMICONDUCTOR WAFER CONSTITUTED BY USING THE SAME Jan 29, 2007 Mar 2, 2018 Kyushu Institute of Technology
22 P2004-100093 P4515131 THRESHOLD CURRENT DENSITY PREDICTING SYSTEM DUE TO EM DAMAGES OF MULTI-LAYERED STRUCTURE WIRING commons meetings Nov 11, 2005 Mar 8, 2018 Japan Science and Technology Agency
23 P2000-227023 P3579332 METHOD AND DEVICE FOR PREDICTING DAMAGE OF WIRING STRUCTURE HAVING PROTECTIVE FILM ON SURFACE commons meetings Aug 28, 2003 Aug 28, 2015 Japan Science and Technology Agency

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