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* Published Japanese patents only


Hits 22 results

No. Application number
Gazette No
Title
Release Date
Update Date
Information Provider
1 P2009-048226 P5544527 COMPOSITE PLATED COATING FILM AND METHOD OF FORMING THE SAME, AND ELECTROPLATING LIQUID Nov 20, 2009 Jan 25, 2018 Shinshu University
2 P2018-147415 P2019-151090A CONJUGATE OF METAL AND RESIN MATERIAL meetings Mar 25, 2019 Jan 29, 2020 Shinshu University
3 P2017-115544 P2019-002034A COPPER/MONOLAYER CARBON NANOTUBE COMPOSITE PLATING METHOD Dec 25, 2017 Jan 20, 2020 Shinshu University
4 P2015-211630 P2017-082286A CUPPER-CNT THREE-DIMENSIONAL NANOSTRUCTURE AND PRODUCTION METHOD OF THE SAME Mar 17, 2016 Jan 20, 2020 Shinshu University
5 P2019-055343 P6667765 ELECTRODE CONNECTION METHOD AND ELECTRODE CONNECTION STRUCTURE Jul 24, 2019 May 27, 2020 Waseda University
6 P2006-287611 P4392506 HEAT RADIATING BODY Aug 18, 2011 Feb 21, 2018 Shinshu University
7 P2015-172501 P6650136 MANUFACTURING METHOD OF FLEXIBLE THERMOELECTRIC CONVERSION MEMBER Mar 29, 2017 Mar 18, 2020 KANAGAWA UNIVERSITY
8 P2013-271076 P6304681 METAL FILM AND METHOD FOR FORMING METAL FILM meetings Apr 30, 2014 Apr 18, 2018 Shinshu University
9 P2006-304671 P5124769 METHOD FOR ELECTROCHEMICALLY IMMOBILIZING PARTICLE Nov 13, 2009 Feb 20, 2018 Kyushu Institute of Technology
10 P2000-323631 P3388408 METHOD FOR MANUFACTURING FILM OF TIN-NICKEL ALLOY Apr 16, 2004 Aug 27, 2003 Japan Science and Technology Agency
11 P2015-156859 P6558769 METHOD FOR MANUFACTURING COPPER THREE-DIMENSIONAL NANOSTRUCTURE HOLDING Sn BASED METAL Mar 15, 2016 Aug 23, 2019 Shinshu University
12 P2009-214920 P5334118 METHOD FOR PLATING ARTICLE WITH Fe-Pt ALLOY AND LIQUID FOR PLATING ARTICLE WITH Fe-Pt ALLOY Mar 19, 2010 Jan 25, 2018 Shinshu University
13 P2016-046711 P6665364 METHOD FOR PRODUCING COPPER THREE-DIMENSIONAL NANOSTRUCTURE May 11, 2016 Mar 23, 2020 Shinshu University
14 P2000-377157 P3388410 METHOD OF MANUFACTURING TIN-NICKEL ALLOY FILM Apr 16, 2004 Aug 26, 2003 Japan Science and Technology Agency
15 P2015-176398 P2017-052984A Ni-P PLATING FILM AND SCALE AND METHOD FOR SUPPRESSING ADHESION OF SESSILE ANIMAL Mar 29, 2017 Jan 8, 2020 Tokyo University of Marine Science and Technology
16 P2005-264716 P5087763 PLASTIC MOLDING HAVING METALLIC FILM, ITS PRODUCTION METHOD, AND ARTICLE USING THE MOLDING AND THE METHOD meetings Aug 16, 2007 Mar 2, 2018 Techno Network Shikoku co.,ltd.
17 P2002-320407 P4032116 PLATED STRUCTURE AND MANUFACTURING METHOD THEREFOR foreign May 16, 2005 Mar 20, 2018 Shinshu University
18 P2006-287668 P4599565 PLATED STRUCTURE AND METHOD OF MANUFACTURING THE SAME Aug 18, 2011 Feb 21, 2018 Shinshu University
19 P2016-046712 P2017-082319A PRODUCTION METHOD OF CUPPER-CNT THREE-DIMENSIONAL NANOSTRUCTURE May 11, 2016 Jan 20, 2020 Shinshu University
20 P2012-124608 P5963191 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME Dec 20, 2013 Dec 26, 2017 Ibaraki University
21 P2015-183828 P6683987 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH ULTRA-LOW RESISTIVITY COPPER WIRING meetings Oct 5, 2016 Jun 9, 2020 Ibaraki University
22 P2005-171670 P5017638 Sn-Cu ALLOY THIN FILM HAVING ANTIBACTERIAL PROPERTY, Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY, AND METHOD FOR PRODUCING Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY meetings Jul 9, 2010 Feb 28, 2018 SUZUKA NATIONAL COLLEGE OF TECHNOLOGY

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