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* Published Japanese patents only


Hits 22 results

No. Application number
Gazette No
Title
Release Date
Update Date
Information Provider
1 P2000-377157 P3388410 METHOD OF MANUFACTURING TIN-NICKEL ALLOY FILM Apr 16, 2004 Aug 26, 2003 Japan Science and Technology Agency
2 P2000-323631 P3388408 METHOD FOR MANUFACTURING FILM OF TIN-NICKEL ALLOY Apr 16, 2004 Aug 27, 2003 Japan Science and Technology Agency
3 P2002-320407 P4032116 PLATED STRUCTURE AND MANUFACTURING METHOD THEREFOR commons foreign May 16, 2005 Mar 20, 2018 Shinshu University
4 P2005-264716 P5087763 PLASTIC MOLDING HAVING METALLIC FILM, ITS PRODUCTION METHOD, AND ARTICLE USING THE MOLDING AND THE METHOD commons meetings Aug 16, 2007 Mar 2, 2018 Techno Network Shikoku co.,ltd.
5 P2006-304671 P5124769 METHOD FOR ELECTROCHEMICALLY IMMOBILIZING PARTICLE Nov 13, 2009 Feb 20, 2018 Kyushu Institute of Technology
6 P2009-048226 P5544527 COMPOSITE PLATED COATING FILM AND METHOD OF FORMING THE SAME, AND ELECTROPLATING LIQUID Nov 20, 2009 Jan 25, 2018 Shinshu University
7 P2005-172730 P4635221 DEVICE AND METHOD FOR ELECTROPLATING MICRO MATERIAL meetings Feb 26, 2010 Feb 26, 2018 Fukuoka University
8 P2009-214920 P5334118 METHOD FOR PLATING ARTICLE WITH Fe-Pt ALLOY AND LIQUID FOR PLATING ARTICLE WITH Fe-Pt ALLOY Mar 19, 2010 Jan 25, 2018 Shinshu University
9 P2005-171670 P5017638 Sn-Cu ALLOY THIN FILM HAVING ANTIBACTERIAL PROPERTY, Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY, AND METHOD FOR PRODUCING Sn-Cu ALLOY THIN FILM-FORMED ARTICLE HAVING ANTIBACTERIAL PROPERTY meetings Jul 9, 2010 Feb 28, 2018 SUZUKA NATIONAL COLLEGE OF TECHNOLOGY
10 P2006-287611 P4392506 HEAT RADIATING BODY commons Aug 18, 2011 Feb 21, 2018 Shinshu University
11 P2012-124608 P5963191 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME Dec 20, 2013 Dec 26, 2017 Ibaraki University
12 P2013-271076 P6304681 METAL FILM AND METHOD FOR FORMING METAL FILM commons meetings Apr 30, 2014 Apr 18, 2018 Shinshu University
13 P2015-156859 P6558769 METHOD FOR MANUFACTURING COPPER THREE-DIMENSIONAL NANOSTRUCTURE HOLDING Sn BASED METAL commons Mar 15, 2016 Aug 23, 2019 Shinshu University
14 P2015-211630 P2017-082286A CUPPER-CNT THREE-DIMENSIONAL NANOSTRUCTURE AND PRODUCTION METHOD OF THE SAME commons Mar 17, 2016 Jan 20, 2020 Shinshu University
15 P2016-046711 P2017-106093A METHOD FOR PRODUCING COPPER THREE-DIMENSIONAL NANOSTRUCTURE UPDATE_EN commons May 11, 2016 Jan 29, 2020 Shinshu University
16 P2016-046712 P2017-082319A PRODUCTION METHOD OF CUPPER-CNT THREE-DIMENSIONAL NANOSTRUCTURE commons May 11, 2016 Jan 20, 2020 Shinshu University
17 P2015-183828 P2016-164965A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH ULTRA-LOW RESISTIVITY COPPER WIRING meetings Oct 5, 2016 Dec 26, 2019 Ibaraki University
18 P2015-172501 P2017-050400A MANUFACTURING METHOD OF FLEXIBLE THERMOELECTRIC CONVERSION MEMBER commons Mar 29, 2017 Jan 8, 2020 KANAGAWA UNIVERSITY
19 P2015-176398 P2017-052984A Ni-P PLATING FILM AND SCALE AND METHOD FOR SUPPRESSING ADHESION OF SESSILE ANIMAL Mar 29, 2017 Jan 8, 2020 Tokyo University of Marine Science and Technology
20 P2017-115544 P2019-002034A COPPER/MONOLAYER CARBON NANOTUBE COMPOSITE PLATING METHOD commons Dec 25, 2017 Jan 20, 2020 Shinshu University
21 P2018-147415 P2019-151090A CONJUGATE OF METAL AND RESIN MATERIAL UPDATE_EN commons meetings Mar 25, 2019 Jan 29, 2020 Shinshu University
22 P2019-055343 P2019-106550A ELECTRODE CONNECTION METHOD AND ELECTRODE CONNECTION STRUCTURE Jul 24, 2019 Jan 17, 2020 Waseda University

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