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* Published Japanese patents only


Hits 9 results

No. Application number
Gazette No
Title
Release Date
Update Date
Information Provider
1 P2009-214920 P5334118 METHOD FOR PLATING ARTICLE WITH Fe-Pt ALLOY AND LIQUID FOR PLATING ARTICLE WITH Fe-Pt ALLOY Mar 19, 2010 Jan 25, 2018 Shinshu University
2 P2012-049896 P5857339 Ni-W ALLOY/CNT COMPOSITE PLATING METHOD AND Ni-W ALLOY/CNT COMPOSITE PLATING LIQUID Jul 20, 2012 Dec 21, 2017 Shinshu University
3 P2015-156859 P6558769 METHOD FOR MANUFACTURING COPPER THREE-DIMENSIONAL NANOSTRUCTURE HOLDING Sn BASED METAL Mar 15, 2016 Aug 23, 2019 Shinshu University
4 P2016-046711 P6665364 METHOD FOR PRODUCING COPPER THREE-DIMENSIONAL NANOSTRUCTURE May 11, 2016 Mar 23, 2020 Shinshu University
5 P2016-046712 P2017-082319A PRODUCTION METHOD OF CUPPER-CNT THREE-DIMENSIONAL NANOSTRUCTURE May 11, 2016 Jan 20, 2020 Shinshu University
6 P2017-115544 P2019-002034A COPPER/MONOLAYER CARBON NANOTUBE COMPOSITE PLATING METHOD Dec 25, 2017 Jan 20, 2020 Shinshu University
7 P2018-125097 P2019-123927A SOLUTION FOR DISSOLVING METAL OR METAL SALT AND UTILIZATION THEREOF achieved foreign May 12, 2020 May 12, 2020 Kyoto University
8 P2016-102229 P2017-212245A METHOD FOR MANUFACTURING FLEXIBLE THERMOELECTRIC CONVERSION MEMBER Dec 20, 2017 Jan 8, 2020 KANAGAWA UNIVERSITY
9 P2015-183828 P6683987 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH ULTRA-LOW RESISTIVITY COPPER WIRING meetings Oct 5, 2016 Jun 9, 2020 Ibaraki University

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